Previous Event - FACHPACK is a European specialist trade fair for packaging, technology and processes.

This year Sylvo Jäger, head of development at microsensys, held a technical presentation on the topic: Digitalization of packaging logistics via auto-ID and connected sensor technologies. In this context, possible applications of electronic, wireless tags and sensors for product protection, bilk identification and environmental monitoring were highlighted, considering different RF technologies with the aim of optimizing processes and improving the use of resources.

If you would like to learn more about this topic of sensor technology, click here or feel free to contact us!