{"id":240995,"date":"2026-02-28T16:00:27","date_gmt":"2026-02-28T15:00:27","guid":{"rendered":"https:\/\/microsensys.adfera.de\/innovation-project-neaixt\/"},"modified":"2026-04-06T09:54:41","modified_gmt":"2026-04-06T07:54:41","slug":"innovation-project-neaixt","status":"publish","type":"page","link":"https:\/\/microsensys.de\/en\/innovation\/innovation-project-neaixt\/","title":{"rendered":"Innovation project: NeAIxt"},"content":{"rendered":"<div class=\"et_pb_section_0 et_pb_section et_section_regular et_flex_section preset--module--divi-section--default\">\n<div class=\"et_pb_row_0 et_pb_row et_flex_row\">\n<div class=\"et_pb_column_0 et_pb_column et-last-child et_flex_column et_pb_css_mix_blend_mode_passthrough et_flex_column_24_24 et_flex_column_24_24_tablet et_flex_column_24_24_phone\">\n<div class=\"et_pb_text_0 et_pb_text et_pb_bg_layout_light et_pb_module et_block_module preset--module--divi-text--default\"><div class=\"et_pb_text_inner\"><h1><span>NeAIxt <\/span><\/h1>\n<\/div><\/div>\n<\/div>\n<\/div>\n<\/div>\n\n<div class=\"et_pb_section_1 et_pb_section et_section_regular et_flex_section preset--module--divi-section--default\">\n<div class=\"et_pb_row_1 et_pb_row et_flex_row\">\n<div class=\"et_pb_column_1 et_pb_column et_flex_column et_pb_css_mix_blend_mode_passthrough et_flex_column_2_5 et_flex_column_2_5_tablet et_flex_column_24_24_phone\">\n<div class=\"et_pb_text_1 et_pb_text et_pb_bg_layout_light et_pb_module et_block_module preset--module--divi-text--ylmmvwaaza\"><div class=\"et_pb_text_inner\"><p>More than sensors<\/p>\n<\/div><\/div>\n\n<div class=\"et_pb_text_2 et_pb_text et_pb_bg_layout_light et_pb_module et_block_module preset--module--divi-text--default\"><div class=\"et_pb_text_inner\"><h1><span>Next-generation Edge AI<\/span><\/h1>\n<\/div><\/div>\n\n<div class=\"et_pb_text_3 et_pb_text et_pb_bg_layout_light et_pb_module et_block_module preset--module--divi-text--72rw9r19df\"><div class=\"et_pb_text_inner\"><p><span style=\"font-size: 22px\">microsensys GmbH is a project participant in the European consortium project NeAIxt (new generation of Edge AI crossing technology fields). <\/span><span style=\"font-size: 22px\">The project is funded under the directive for promoting microelectronics research by consortium partners within the Chips Joint Undertaking. <\/span><\/p>\n<\/div><\/div>\n<\/div>\n\n<div class=\"et_pb_column_2 et_pb_column et-last-child et_flex_column et_pb_css_mix_blend_mode_passthrough et_flex_column_3_5 et_flex_column_3_5_tablet et_flex_column_24_24_phone\">\n<div class=\"et_pb_text_4 et_pb_text et_pb_bg_layout_light et_pb_module et_block_module preset--module--divi-text--default\"><div class=\"et_pb_text_inner\"><h3><strong>Project overview <\/strong><\/h3>\n<p>NeAIxt is a three-year European research and innovation project developing the next generation of secure, energy-efficient, high-performance Edge AI, making an important contribution to Europe\u2019s digital and industrial future.<\/p>\n<p>The project is coordinated by STMicroelectronics and co-funded by the CHIPS Joint Undertaking under Horizon Europe.<\/p>\n<p>With 66 partners from 14 European countries\u2014including large enterprises, SMEs, research and technology organisations, and academic institutions\u2014NeAIxt brings together extensive expertise across the entire microelectronics and artificial intelligence value chain.<\/p>\n<p>&nbsp;<\/p>\n<h3><strong>Project objectives <\/strong><\/h3>\n<p>The aim of NeAIxt is to scale and further develop key technologies for artificial intelligence at the network edge (Edge AI):<\/p>\n<ul>\n<li><strong>Scaling up:<\/strong><span> <\/span>Broad industrial applicability and high market readiness<\/li>\n<li><strong>Enhancing:<span> <\/span><\/strong>Improved accuracy, performance, and energy efficiency<\/li>\n<li><strong>Demonstration:<\/strong><span> <\/span>Deployment of the developed technologies in large volumes and real industrial applications<\/li>\n<\/ul>\n<p>In doing so, NeAIxt strengthens Europe\u2019s technological sovereignty and enables reliable AI functionality directly on the end device (\u201con-device\u201d).<\/p>\n<p>&nbsp;<\/p>\n<h3><strong>Technological focus areas <\/strong><\/h3>\n<p>NeAIxt addresses key hardware and software enablers for Edge AI systems:<\/p>\n<ul>\n<li><strong>Embedded Non-Volatile Memory (eNVM):<\/strong><span> <\/span>Further development of the eNVM roadmap with a focus on advanced technologies such as ePCM, OxRAM, and FeRAM, optimised for AI workloads<\/li>\n<li><strong>FD-SOI-based chip architectures:<span> <\/span><\/strong>Foundation for particularly energy-efficient, secure, and high-performance Edge AI solutions<\/li>\n<li><strong>Edge AI hardware and software:<span> <\/span><\/strong>Development of specialised microcontroller architectures (MCUs), including a coordinated software ecosystem of frameworks, tools, and libraries<\/li>\n<li><strong>Low-Power &amp; Security:<span> <\/span><\/strong>Architectures for extremely low power consumption and secure AI processing directly at the network edge<\/li>\n<\/ul>\n<p>&nbsp;<\/p>\n<\/div><\/div>\n<\/div>\n<\/div>\n\n<div class=\"et_pb_row_2 et_pb_row et_flex_row\">\n<div class=\"et_pb_column_3 et_pb_column et_flex_column et_pb_css_mix_blend_mode_passthrough et_flex_column_3_5 et_flex_column_3_5_tablet et_flex_column_24_24_phone\">\n<div class=\"et_pb_image_0 et_pb_image et_pb_module et_block_module preset--module--divi-image--default\"><span class=\"et_pb_image_wrap\"><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/microsensys.de\/wp-content\/uploads\/2026\/02\/NeAIxt_logotype_CMJN_basique_blanc-scaled.jpg\" title=\"NeAIxt_logotype_CMJN_basique_blanc\" width=\"2560\" height=\"983\" srcset=\"https:\/\/microsensys.de\/wp-content\/uploads\/2026\/02\/NeAIxt_logotype_CMJN_basique_blanc-scaled.jpg 2560w, https:\/\/microsensys.de\/wp-content\/uploads\/2026\/02\/NeAIxt_logotype_CMJN_basique_blanc-1280x492.jpg 1280w, https:\/\/microsensys.de\/wp-content\/uploads\/2026\/02\/NeAIxt_logotype_CMJN_basique_blanc-980x376.jpg 980w, https:\/\/microsensys.de\/wp-content\/uploads\/2026\/02\/NeAIxt_logotype_CMJN_basique_blanc-480x184.jpg 480w\" sizes=\"(min-width: 0px) and (max-width: 480px) 480px, (min-width: 481px) and (max-width: 980px) 980px, (min-width: 981px) and (max-width: 1280px) 1280px, (min-width: 1281px) 2560px, 100vw\" class=\"wp-image-240972\" \/><\/span><\/div>\n<\/div>\n\n<div class=\"et_pb_column_4 et_pb_column et-last-child et_flex_column et_pb_css_mix_blend_mode_passthrough et_flex_column_2_5 et_flex_column_2_5_tablet et_flex_column_24_24_phone\">\n<div class=\"et_pb_text_5 et_pb_text et_pb_bg_layout_light et_pb_module et_flex_module preset--module--divi-text--default\"><div class=\"et_pb_text_inner\"><h3><strong>Application areas<\/strong><strong><\/strong><\/h3>\n<p>The solutions developed in the project address a broad spectrum of industrial and societal application areas:<\/p>\n<ul>\n<li>Automotive industry<\/li>\n<li>Industrial and automation engineering<\/li>\n<li>Internet of Things (IoT)<\/li>\n<li>Security and safety-critical applications<\/li>\n<\/ul>\n<\/div><\/div>\n<\/div>\n<\/div>\n\n<div class=\"et_pb_row_3 et_pb_row et_flex_row\">\n<div class=\"et_pb_column_5 et_pb_column et-last-child et_flex_column et_pb_css_mix_blend_mode_passthrough et_flex_column_24_24 et_flex_column_24_24_tablet et_flex_column_24_24_phone\">\n<div class=\"et_pb_text_6 et_pb_text et_pb_bg_layout_light et_pb_module et_block_module preset--module--divi-text--default\"><div class=\"et_pb_text_inner\"><h2><strong>microsensys\u2019 contribution <\/strong><\/h2>\n<p><span>Battery-powered wireless sensors play a central role in applications where high flexibility and strong miniaturisation are required. In particular, in the transport sector they capture and monitor a wide range of physical parameters. Since wireless transmission causes the greatest energy demand compared to measurement data acquisition, it is crucial to activate the wireless functionality only when it is actually needed\u2014for example, when a suitable receiver is within range.  <\/span><\/p>\n<p><span>As part of the NeAIxt research project, microsensys GmbH is therefore developing, together with project partners, a novel sensor that can be selectively woken using passive UHF RFID technology and transmits the captured measurement data via a battery-powered BLE SoC. This is based on a specially developed RFID ASIC that uses particularly fast and energy-efficient FeRAM memory technologies. This enables the sensor to be used even on fast-moving objects, where only short time windows are available for activation and data transmission.  <\/span><\/p>\n<p><span>To further minimise power consumption and ensure particularly fast data transmission, embedded ML methods for data reduction are also used directly in the sensor. This results in a highly integrated Edge AI system that provides the basis for long-lasting, energy-efficient, and responsive sensor networks. <\/span><\/p>\n<p><span>If you would like to learn more about our project, please visit our <\/span><a href=\"https:\/\/neaixt.eu\/\" target=\"_blank\" rel=\"noopener\">project website. <\/a> <\/p>\n<p>&nbsp;<\/p>\n<\/div><\/div>\n\n<div class=\"et_pb_row_4 et_pb_row et_pb_row_nested et_flex_row\">\n<div class=\"et_pb_column_6 et_pb_column et_flex_column et_pb_css_mix_blend_mode_passthrough et_flex_column_2_5 et_flex_column_2_5_tablet et_flex_column_24_24_phone\">\n<div class=\"et_pb_text_7 et_pb_text et_pb_bg_layout_light et_pb_module et_flex_module preset--module--divi-text--default\"><div class=\"et_pb_text_inner\"><h3>Funded by<\/h3>\n<\/div><\/div>\n<\/div>\n\n<div class=\"et_pb_column_7 et_pb_column et-last-child et_flex_column et_pb_css_mix_blend_mode_passthrough et_flex_column_3_5 et_flex_column_3_5_tablet et_flex_column_24_24_phone\">\n<div class=\"et_pb_image_1 et_pb_image et_pb_module et_flex_module preset--module--divi-image--default\"><span class=\"et_pb_image_wrap\"><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/microsensys.de\/wp-content\/uploads\/2026\/02\/TH_TMWLLR_rgb_mitte-1.jpg\" title=\"TH_TMWLLR_rgb_mitte (1)\" width=\"1135\" height=\"257\" srcset=\"https:\/\/microsensys.de\/wp-content\/uploads\/2026\/02\/TH_TMWLLR_rgb_mitte-1.jpg 1135w, https:\/\/microsensys.de\/wp-content\/uploads\/2026\/02\/TH_TMWLLR_rgb_mitte-1-980x222.jpg 980w, https:\/\/microsensys.de\/wp-content\/uploads\/2026\/02\/TH_TMWLLR_rgb_mitte-1-480x109.jpg 480w\" sizes=\"(min-width: 0px) and (max-width: 480px) 480px, (min-width: 481px) and (max-width: 980px) 980px, (min-width: 981px) 1135px, 100vw\" class=\"wp-image-240970\" \/><\/span><\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>","protected":false},"excerpt":{"rendered":"","protected":false},"author":1,"featured_media":0,"parent":241557,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-240995","page","type-page","status-publish","hentry"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.3 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Innovation Project NeAIxt | microsensys<\/title>\n<meta name=\"description\" content=\"NeAIxt: Next-generation edge AI meets RFID sensor technology. 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